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Yao Liu

Heat transfer process between polymer and cavity wall during injection molding

Autor: Yao Liu

ISBN: 978-3-944640-40-2

Seitenzahl: 129

Erscheinungsdatum: 01.01.2015

 

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Produktinformationen "Heat transfer process between polymer and cavity wall during injection molding"

Injection molding is one of the most commonly applied processing methods for plastic components. Heat transfer coefficient (HTC), which describes the heat conducting ability of the interface between a polymer and cavity wall, significantly influences the temperature distribution of a polymer and mold during injection molding and thus affects the process and quality of plastic products. This thesis focuses on HTC under diverse processing situations. On the basis of the heat conducting principle, a theoretical model for calculating HTC was presented. Injection mold specially used for measuring and calculating HTC was designed and fabricated. Experimental injection studies under different processing conditions, especially different surface roughness, were performed for acquiring necessary temperature data. The heat quantity across the interface and HTC between a polymer and cavity wall was calculated on the basis of experimental results. The influence of surface roughness on HTC during injection molding was investigated for the first time. The factors influencing the HTC were analyzed on the basis of the factor weight during injection molding. Subsequently FEM (Finite element method) simulations were carried out with observed and preset value of HTC respectively and the relative crystallinity and part density were obtained. In the comparison between results from simulation and experiment, the result calculated with observed HTC shows better agreement with actually measured value, which can verify the reliability and precision of the injection molding simulation with observed HTC. The results of this thesis is beneficial for understanding the heat transfer process comprehensively, predicting temperature distribution, arranging cooling system, reducing cycle time and improving precision of numerical simulation.
 

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